印刷電路板
士寶以生產電路板為主，電路板(Printed Circuit Board; PCB)為各項電子產品中的關鍵零組件，其用途做為承載各電子元件及元件間訊息傳遞之媒介(Interconnection)，主要的業務範圍包含 一般多層電路板、高密度電路板(HDI)、高層次板(HLC)、軟板(FPC)與軟硬板(Rigid-Flex PCB)等產品的生產製造之ISO與UL認證標準，同時針對客戶的產品規格與需求，打造專屬於客戶的SMT產品規格。
Quality Management
QMS 010 ISO 9001: 2008 QC 019
剛性印刷電路版
生產能力
Layer Count
Materials
Max Copper Thickness
Min Copper Thickness
Min Line Width/Space
Min Drilling Hole Diameter
Max Aspect Ratio
Max Finished Board Size
Max Board Thickness
Min Board Thickness
PCB Surface Finishing
Color of Solder Mask
Special Technology
2-50 L
FR4 (TG140、150、155、170、180) Halogen-free、Roger、PB free
6oz
1/3oz
2mil / 2mil
4mil (0.1mm)
43
22''x28''
6.35mm
2L: 0.2mm 、4L: 0.3mm
6L: 0.4mm 、8L: 0.6mm
Immersion Gold、Tin、Silver、OSP、
Leadfree HASL、HASL、Carbon、 Peelable Mask、Gold Finger
Green、Black、White、Blue 、Red
Blind & Buried via、Controlled Impedance、 Epoxy via plug、Copper Fill Plating、
Laser Drill、Class 3
1+N+1、1+1+N+1+1、1+1+1+N+1+1+1
2+N+2、3+N+3 & Any Layer
2mil / 2mil
6mil (0.15mm)
4mil (0.1mm)
43
Immersion Gold、Tin、Silver、OSP、
Leadfree HASL、HASL、Carbon、 Peelable Mask、Gold Finger
Green、Black、White、Blue 、Red
高密度印刷電路板
撓性電路板
Rigid-Flex Printed Circuit Board
軟硬複合版
生產能力
Max PCBA Dimensions
Parts Procurment
ASSEMBLY
Surface Mount
Thru-Hole
RoHS Compliant and
Lead-free Soldering
Final Product Assembly (Box Build)
Inspection / Testing / Analysis / Repair / Rework
- Automatic Optical Inspection (AOI)
- 3D X-RAY Inspection
- In-Circuit Testing
- Functional Testing
- Touch-up & Troubleshooting
1,200mm* 400mm
600mm* 500mm
Turn-Key Procurement
Kitted / Consigned
Single/Double Sided Lead-free reflow
Soldering Process
Single/Double Sided Lead-free Dual Wave Multi-Point Soldering Process